Available Technologies by Category
Skin-Conformal Wearable Stress Monitor Delivers Greater Precision and Continuous, Wireless Monitoring with Comfort and Flexibility
  • All-in-one: The personal adhesive bandage-like single device platform offers wireless, multi-data sensing by simply mounting it on the skin.
  • Disposable: This wearable device is fully disposable after the use and the measured data can be simply sent to the cloud via a tablet or smartphone app.
  • Compact: The unique, thin design of this bioelectric device is one-sixth the volume of current market offerings—weighing less than 7 g, including its rechargeable battery.
8414
Smart Webcam Shield Protects Users from Unknown External Digital Intrusion
  • Secure: Offers visual obstruction of the webcam even when remote software attempts to record without triggering the computer’s LED indicator  
  • Reliable: Automates the webcam safeguard for ongoing protection without reliance on user engagement
  • Flexible: Enables two different actuators via the same sensor
8610
Enabling Multi-Beam, High-Capacity Massive MIMO for 5G Communications and More
  • State-of-the-art: Is the first Rx-array design of its kind, autonomously achieving modulated blocker suppression and desired signal beamforming simultaneously without the need for a digital beamforming aid  
  • Robust: Enables multi-beam high-capacity massive MIMO to address the demands of both commercial and defense applications
  • Scalable: Employs ASFs that achieve 4-element spatial filters with sharpened selectivity that can be extended to larger array sizes of thousands of elements and cancellation of any number of interference signals
8120
Virtual Sensing Integrated for Predictive Reliability (VIPR)
  • Advanced: Acquires system data via virtual sensing, without the need for physical sensors in all desired locations
  • Cost-reducing: Aims to reduce maintenance and planning costs for solid rocket motors and potentially other vehicle propulsion systems
  • Predictive: Provides useful, repeatable, extensive data sets to predict rocket performance and enable proactive plans for propulsion system maintenance, upgrades, and replacements, potentially reducing downtime and failures
8555
Integrating Electrical Sensors into Soft-Lithography Microfluidic Devices
  • Sophisticated: Advances the integration of electrical sensors on microfluidic devices with a simple, approachable solution
  • Sensitive: Demonstrates a higher signal sensitivity than electrodes in a typical coplanar arrangement
  • Adaptable: Allows for greater layout flexibility because of its straightforward fabrication process
7769
Microfluidic CODES with Innovative Machine-Learning Analysis
  • Scalable: Set-up allows for the integration of multiple microfluidic devices to increase throughput volume.
  • Versatile: Machine learning analysis can be applied to other microfluidic devices integrated with the same Coulter sensor network.
  • Pragmatic: This innovation improves the capabilities of lab-on-a-chip systems to provide an affordable solution for low-resource settings.
7107, 8032
Utilizing Impedance Spectroscopy for Advanced Characterization of Particles
  • Comprehensive: Simultaneously measures both spatial and dielectric properties of particles
  • Streamlined: Helps resolve signal interference from coincident cells—a challenge of other assessment techniques
  • Precise: Offers complex impedance as a new level of particle feature assessment, integrating it with other measurements such as elasticity and size for more predictive analyses
8049
Fully Integrated, Piezoelectric Standalone MEMS Frequency Combs
  • Compact: Provides a fully integrated package with a smaller footprint (30 μm x 30 μm) compared with CMOS-MEMS configurations
  • Robust: Offers higher sensitivity and enhanced detection limit compared with the previous state of the art
  • Low noise: Lowers shot noise levels associated with electronics and MEMS circuitry by eliminating the need for circuitry like electronic amplifiers
7875
Heterogeneous Integration Method for III-Nitride Devices
  • High performance: Enables simple and fast transfer to foreign substrates with an automated pick-and-place technique
  • Compatible: Can be used to transfer devices of any shape and size—from micron to millimeter
  • Efficient: Allows reuse of the growth wafer, lowering production costs
7910
Electronic Barrier and Enforcement System and Method
  • Improve overall performance of the transportation system while reducing enforcement costs and need for law enforcement resources
  • Reduces the need for a physical barrier between the HOV/HOT and general purpose lanes
  • Addresses traffic management problems through the implementation of automated electronic enforcement of barrier to integrity 
4613
Ultra-Thin Interposer Assemblies for Higher Integrated Circuit Bandwidth
  • Scalable, with connections above, below, and beside the interposer
  • Lower cost, less complex manufacturing through interposer-package integration
  • Testable, both before and after device integration
5453
Crane Control Using Real-Time Location Systems
  • Relatively simple technology
  • Saves time that would be spent training operators
  • Can be applied to existing cranes
5318
Advance Mobility Improvement for Organic Field Effect Transistors
  • Dramatic increase in mobility: Yields a 2-order-of-magnitude increase in charge transport
  • Fast: Achieves 100-fold improvements after a mere 5 minutes of ultrasound
  • Simple: Requires only low-intensity ultrasound and eliminates the need for dielectric surface modifications or post-deposition treatment of the device
5187
Method to modify the Conductivity of Graphene
  • Does not require the application of a dielectric layer to the graphene
  • Graphene does not need to be chemically modified
  • Maintains quality of graphene
5042
High-Speed Autofocus Interometric Inspection System
  • High-speed
  • Fully noncontact
  • Nondestructive inspection techniques for investigating solder bump and joint integrity
4750
Self-Aligned HARPSS Micromechanical Variable Capacitors
  • Results in larger-value capacitors
  • Requires only three lithography masks
4359
Retrieving 3D Information for Probe Microscopy
  • Can isolate the central region of a diffraction spot from its respective fringes
  • Creates ideal diffraction patterns
3597
Molded Microfluidic Fluid Cell for Atomic Force Microscopy
  • More precise — Three orders of magnitude decrease in volume of fluid containment when working with the microscope
  • Cost-saving — Allows for the use of less analyte (important for drug companies)
4847
MINTED: Simultaneous Deformation and Temperature Imaging
  • Simultaneous recording of small-scale temperature and deformation fields at high spatial and time resolutions
  • Studies deformation, failure, and heating in a range of materials
  • Analyzes/monitors heating and failure of MEMS devices, microchips, and circuit board
8064
Fabrication of Slanted Electrodes in MEMS Devices
  • High Performance – slanted electrodes provide more capabilities and possibilities for MEMS devices
  • Consolidated – reduces the need for large systems of MEMS
  • Versatile – MEMS with slanted electrodes can be applied to many applications
7324