Available Technologies by Category
Leverage the Advantages of Aluminum Nitride for Superior Ultra-Wide Bandgap Semiconductors for High-Power, High-Temperature Diodes and Transistors
  • Metal modulated epitaxy method enables the production of p-type beryllium-doped aluminum nitride films as key components in ultra-wide bandgap semiconductors for the first time. 
  • Achieves high reverse breakdown voltage—a significant advantage over wide bandgap materials such as silicon carbide and gallium nitride.
  • Improves current conduction over best previous results in p-type aluminum nitride (AIN) by 30,000,000 times and n-type AlN by 6,000 times.
Chemically Modified Reduced Graphene Oxides (rGOs) Improve Strength and Qualities of Polymer Composites
  • Chemically modifying rGO creates improved dispersibility and miscibility that can be used in polymer processes as a composite reinforcement or coating material.
  • Easily scalable solution chemistry and purification/filtration makes the process economically feasible, resulting in a commercially viable material for many applications.
  • Melt lamination results in a robust conductive coating that is more durable than comparable polymer-based coatings and enables many electronically active device designs.
Buoyant Platform Assembly Improves PCM Thermal Management
  • Enhances solidification: Incorporating highly localized agitation via a stirring whip rod, this technology seeds solidification to improve this often-arduous phase of PCM thermal cycling. 
  • Prevents scale build-up: This technology reduces the instance of sheets of solid PCM forming on the heat sink. The high-frequency, extensible whip rod orbits around the passageway to facilitate nucleation (creating improved solidification), while preventing scale build-up on the interior passageway surfaces. 
  • Customizable: The structural design allows the platform to be tailored to the effective density of the PCM material, enabling it to stay between the liquid and solid phases. 
Eco-Method Mordant that Improves Natural Dye Adhesion to Synthetic Fabrics
  • Eco-friendly: An improved industrial dyeing process because it reduces excessive heat and water contamination during manufacturing.
  • Wide applicability: Demonstrated to be successful with other materials beyond polyester, including Kevlar and polyacrylonitrile (PAN).
  • Improved quality: Improving commercial dye methods without losing the desired properties of polyester such as flexibility is beneficial to industries like medical supply.
Spin-Coated Polymer Collars Prevent Solder Wicking
  • Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer
  • Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints
  • Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.
Unique Processing Method for Highly Durable Bismaleimide Plastic
  • Highly durable: Demonstrates an impact strength of up to 69 kilo joules per square meter—a 392% increase over BMI that did not undergo HSSM processing
  • High-fidelity: Overcomes the typical limitations of BMI without the use of chemical additives
  • Straightforward: Requires only simple, conventional equipment for development
Ceramic Pump and Valve for Liquid Metals
  • First of its kind
  • Set the world record for the hottest fluid ever pumped continuously
  • Opens up new industry applications