Available Technologies by Category
Overvoltage Surge Protection System for Distributed Energy Resources
  • iMOV is a dynamic system capable of achieving voltage surge clamping within 20% of the system’s nominal voltage. This effectively provides protection for highly sensitive semiconductors present in DER-associated power converters. 
  • This system is built upon a metal oxide varistors (MOV) foundation, whose material composition inherently allows rapid device connection of 500 picoseconds for quicker response times. 
  • iMOV uses integrated microprocessors and sensors in a cloud-based architecture that provides protection against cyberattacks, reduces system cost, and allows system and power grid monitoring.
Microgeodes Enable Tunable Optical Response for Advanced Coatings/Paint
  • Microgeodes have a programmable structure of nanowires that allows their optical response to be engineered precisely over multiple spectral bands, from UV through mid-IR. 
  • Microgeodes combine the tunability and versatility of nanowires with the processability of microspheres to provide a photonic materials platform for a wide range of applications. 
  • Microgeode paints could reduce building surface temperatures by as much as 25°C, offering the potential for significant consumer savings while retaining aesthetically pleasing colors.
Solar Cell Manufacturing Technique Increases Efficiency and Lowers Costs
  • This double-side polysilicon/silicon oxide TOPCon (tunnel oxide passivated contact) solar cell concept provides a simple and low-cost way to passivate front and back surfaces of silicon wafers to enhance efficiency.
  • Provides current and voltage comparable to full-area double-side TOPCon but with no appreciable absorption in front polysilicon and without compromising short circuit current density
  • Includes a novel and fast way to pattern polysilicon using laser-induced selective oxidation
Novel Silicon Radiation Detector Enabled By Tunnel Oxide Passivating Contact
  • The technology passivates the bottom surface well and suppresses electron recombination near the bottom contact, resulting in low leakage current.
  • Passivating the silicon surface and decreasing hole recombination near the front contact leads to low recombination current density at the surface and low effective contact resistivity.
  • An extremely low J0 for the tunnel oxide passivating contact on both sides yields a higher energy resolution and lower noise level.
Superluminescent Light Projection (SLP) System Decreases Nanoscale Printing Costs by 10–50 Times
  • This superluminescent light projection (SLP) system decreases overall nanoscale printing costs by 10–50 times. 
  • A parallel writing mechanism supports higher throughput speeds: up to 100 times higher than existing metal printing methods and four times higher than existing polymer printing methods. 
  • SLP creates sharp-edged images with minimal speckling patterns, resulting in high-resolution images and structures on both polymer and metal-based films. 
Metasurface Enables Rapid, Sensitive, and Low-Cost Permittivity Characterization of Dielectric Materials at Radio Frequencies
  • Characterize complex permittivity of dielectric materials at radio frequencies quickly and at lower cost than with existing techniques. 
  • The electronically reconfigurable system allows integration of active electronics for tunability and eliminates the need for several masks to achieve the needed bandwidth.
  • Measure individual frequencies by swapping out only the metasurfaces, which can be used on a wide range of sample thicknesses.
Lightweight, Versatile Cryogenic Conductors
  • Lithium exhibits lower atomic mass, higher power density, and lower losses under cryogenic conditions
  • Conductors such as lithium become even more power-dense at lower temperatures, exhibiting improved electrical performance 
  • Cladding with copper enables lithium to be drawn using standard wire-drawing techniques and tools
Raised Cosine (RC) Pulse Shaping for Next Generation Multi-Mode Fiber (MMF) Links
  • Small design: Uses direct modulation and detection with VCSEL-based MMF links for small form factor
  • High speeds with low cost and power: Achieves speeds of 100 Gbps and higher while maintaining low cost and low power consumption with VCSEL MMF-based links and other direct-modulated lasers
  • Low bandwidth requirements: Minimizes intersymbol interference and reduces the required electrical bandwidth to enable use with commercially packaged VCSELs that have bandwidth in the low 20 GHz range
Thin Current Spreading Layers Improve Breakdown Performance
  • Increases current uniformity: Improves cumulative current flow distribution from ~40% to ~100% of the p-type contact
  • Improves breakdown performance: Avoids premature breakdown at the mesa edges making quasi-vertical devices comparable in performance to more expensive vertical devices.
  • Improves Immunity to Etch Variation: Because current flow is no longer crowded along the mesa edges, process related variations in the mesa etching are less important to the diode performance.
Cascaded Nickel Hard Mask
  • Substantially deeper etches: Because a very thick metal mask can be created, a wide range of µm features can be etched in a variety of III-Nitride semiconductors, allowing for extremely high voltage devices that require thicker layer structures
  • Robust: This method has demonstrated highly consistent and effective protection against the kind of damage that is typical with standard fabrication methods
  • Scalable: The nickel hard mask with cascaded e-beam evaporation and sputtering metal deposition method can readily be applied to the large-scale production of electronic devices
p-type Be-Doped AlN Films and Layered Films
  • Enabling: Leverages MME method to provide the first access to p-type AlN:Be films, a superior ultra-wide bandgap semiconductor material good for high-power, high-temperature diodes and transistors
  • Ease of fabrication: Avoids costly and complicated methods unfavorable for beryllium doping
  • Improved breakdown performance: Achieves high reverse breakdown voltage—a significant advantage over WBG materials such as silicon carbide (SiC) and GaN
8810, 8666, 8786
A Method for Creating a Protective Cap Layer for Semiconductor Wafers
  • Protective: Provides a thin protective layer or “cap” after the first layer is deposited, protecting the underlying structure from atmospheric contaminants
  • Robust: Enables realization of the advantages of hybrid growth processes by eliminating performance-degrading contaminants and resulting defects
  • Advanced: Offers superior protection against contamination compared with simple chemical cleaning methods utilized in other systems, especially against impurity species such as oxides
Chip-Scale Electrochemical Double-Layer (ECDL) Supercapacitors
  • Decreased size: Minimizes space that does not contribute to volumetric density and is drastically smaller than conventional ECDL capacitors, allowing capacitor-dependent devices to shrink considerably
  • High power: Achieves gravimetric energy densities of over 100 watt-hours per kilogram
  • Improved performance: The vertically aligned graphene-functionalized carbon nanotubes Offers high porosity and surface area for improved pseudocapacitance by vertically aligning graphene-functionalized nanotubes
Spin-Coated Polymer Collars Prevent Solder Wicking
  • Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer
  • Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints
  • Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.
Fabricating High-Power Solar Cells with a Novel Boron Emitter
  • Efficient: Demonstrates a competitive level of efficiency road map of over 24.2%
  • Cost-effective: Offers a simplified approach for fabricating TOPCon solar cells while still maintaining their efficiency
  • Sustainable: Improves upon current renewable energy solutions that provide alternatives to fossil fuel–based energy consumption
Heterogeneous Integration Method for III-Nitride Devices
  • High performance: Enables simple and fast transfer to foreign substrates with an automated pick-and-place technique
  • Compatible: Can be used to transfer devices of any shape and size—from micron to millimeter
  • Efficient: Allows reuse of the growth wafer, lowering production costs
High-Performance Broadband Photodetector and Power Generator
  • Versatile: Adjusts for several different parameters, including light intensity, switching frequency, and illumination area
  • Efficient: Provides voltage that is easily converted for use through a medium that is small, low cost, and easily fabricated
  • Highly sensitive: Operates with ultra-high light sensitivity, even at very low light intensity, and fast response speeds
A Semiconductor Particle Detector Based on Work Function Modulation
  • Small: Can be used as a portable radiation detector
  • Versatile: Can be implemented in current particle detectors for accuracy testing and experimental verification
  • Scalable: Offers the potential to be used in creating an array of devices for implementation in larger research experiments
Efficient, Reliable, Robust Power Amplifiers for Wireless Communications
  • Increased efficiency — Satisfies zero voltage switching condition at 50% duty cycle and shapes the drain voltage at other duty cycles to minimize power loss
  • Improved reliability — Reduces peak drain swing
  • Mitigated variation — Determines optimal adaptation settings for each process shifted device using on-chip sensors and digital logic
New Methods of Fabrication for Biosensor Arrays
  • Low manufacturing and operating cost
  • Compatible with multiple standard electrochemical techniques
  • Can be used with CMOS detection chips with multiple chemical detection and/or actuation channels or sites