Available Technologies by Category
Leverage the Advantages of Aluminum Nitride for Superior Ultra-Wide Bandgap Semiconductors for High-Power, High-Temperature Diodes and Transistors
  • Metal modulated epitaxy method enables the production of p-type beryllium-doped aluminum nitride films as key components in ultra-wide bandgap semiconductors for the first time. 
  • Achieves high reverse breakdown voltage—a significant advantage over wide bandgap materials such as silicon carbide and gallium nitride.
  • Improves current conduction over best previous results in p-type aluminum nitride (AIN) by 30,000,000 times and n-type AlN by 6,000 times.
Overvoltage Surge Protection System for Distributed Energy Resources
  • iMOV is a dynamic system capable of achieving voltage surge clamping within 20% of the system’s nominal voltage. This effectively provides protection for highly sensitive semiconductors present in DER-associated power converters. 
  • This system is built upon a metal oxide varistors (MOV) foundation, whose material composition inherently allows rapid device connection of 500 picoseconds for quicker response times. 
  • iMOV uses integrated microprocessors and sensors in a cloud-based architecture that provides protection against cyberattacks, reduces system cost, and allows system and power grid monitoring.
Microgeodes Enable Tunable Optical Response for Advanced Coatings/Paint
  • Microgeodes have a programmable structure of nanowires that allows their optical response to be engineered precisely over multiple spectral bands, from UV through mid-IR. 
  • Microgeodes combine the tunability and versatility of nanowires with the processability of microspheres to provide a photonic materials platform for a wide range of applications. 
  • Microgeode paints could reduce building surface temperatures by as much as 25°C, offering the potential for significant consumer savings while retaining aesthetically pleasing colors.
Solar Cell Manufacturing Technique Increases Efficiency and Lowers Costs
  • This double-side polysilicon/silicon oxide TOPCon (tunnel oxide passivated contact) solar cell concept provides a simple and low-cost way to passivate front and back surfaces of silicon wafers to enhance efficiency.
  • Provides current and voltage comparable to full-area double-side TOPCon but with no appreciable absorption in front polysilicon and without compromising short circuit current density
  • Includes a novel and fast way to pattern polysilicon using laser-induced selective oxidation
Superluminescent Light Projection (SLP) System Decreases Nanoscale Printing Costs by 10–50 Times
  • This superluminescent light projection (SLP) system decreases overall nanoscale printing costs by 10–50 times. 
  • A parallel writing mechanism supports higher throughput speeds: up to 100 times higher than existing metal printing methods and four times higher than existing polymer printing methods. 
  • SLP creates sharp-edged images with minimal speckling patterns, resulting in high-resolution images and structures on both polymer and metal-based films. 
Metasurface Enables Rapid, Sensitive, and Low-Cost Permittivity Characterization of Dielectric Materials at Radio Frequencies
  • Characterize complex permittivity of dielectric materials at radio frequencies quickly and at lower cost than with existing techniques. 
  • The electronically reconfigurable system allows integration of active electronics for tunability and eliminates the need for several masks to achieve the needed bandwidth.
  • Measure individual frequencies by swapping out only the metasurfaces, which can be used on a wide range of sample thicknesses.
Novel Silicon Radiation Detector Enabled By Tunnel Oxide Passivating Contact
  • The technology passivates the bottom surface well and suppresses electron recombination near the bottom contact, resulting in low leakage current.
  • Passivating the silicon surface and decreasing hole recombination near the front contact leads to low recombination current density at the surface and low effective contact resistivity.
  • An extremely low J0 for the tunnel oxide passivating contact on both sides yields a higher energy resolution and lower noise level.
Lightweight, Versatile Cryogenic Conductors
  • Lithium exhibits lower atomic mass, higher power density, and lower losses under cryogenic conditions
  • Conductors such as lithium become even more power-dense at lower temperatures, exhibiting improved electrical performance 
  • Cladding with copper enables lithium to be drawn using standard wire-drawing techniques and tools
Raised Cosine (RC) Pulse Shaping for Next Generation Multi-Mode Fiber (MMF) Links
  • Small design: Uses direct modulation and detection with VCSEL-based MMF links for small form factor
  • High speeds with low cost and power: Achieves speeds of 100 Gbps and higher while maintaining low cost and low power consumption with VCSEL MMF-based links and other direct-modulated lasers
  • Low bandwidth requirements: Minimizes intersymbol interference and reduces the required electrical bandwidth to enable use with commercially packaged VCSELs that have bandwidth in the low 20 GHz range
A Method for Creating a Protective Cap Layer for Semiconductor Wafers
  • Protective: Provides a thin protective layer or “cap” after the first layer is deposited, protecting the underlying structure from atmospheric contaminants
  • Robust: Enables realization of the advantages of hybrid growth processes by eliminating performance-degrading contaminants and resulting defects
  • Advanced: Offers superior protection against contamination compared with simple chemical cleaning methods utilized in other systems, especially against impurity species such as oxides
Chip-Scale Electrochemical Double-Layer (ECDL) Supercapacitors
  • Decreased size: Minimizes space that does not contribute to volumetric density and is drastically smaller than conventional ECDL capacitors, allowing capacitor-dependent devices to shrink considerably
  • High power: Achieves gravimetric energy densities of over 100 watt-hours per kilogram
  • Improved performance: The vertically aligned graphene-functionalized carbon nanotubes Offers high porosity and surface area for improved pseudocapacitance by vertically aligning graphene-functionalized nanotubes
Spin-Coated Polymer Collars Prevent Solder Wicking
  • Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer
  • Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints
  • Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.
Fabricating High-Power Solar Cells with a Novel Boron Emitter
  • Efficient: Demonstrates a competitive level of efficiency road map of over 24.2%
  • Cost-effective: Offers a simplified approach for fabricating TOPCon solar cells while still maintaining their efficiency
  • Sustainable: Improves upon current renewable energy solutions that provide alternatives to fossil fuel–based energy consumption
Heterogeneous Integration Method for III-Nitride Devices
  • High performance: Enables simple and fast transfer to foreign substrates with an automated pick-and-place technique
  • Compatible: Can be used to transfer devices of any shape and size—from micron to millimeter
  • Efficient: Allows reuse of the growth wafer, lowering production costs
High-Performance Broadband Photodetector and Power Generator
  • Versatile: Adjusts for several different parameters, including light intensity, switching frequency, and illumination area
  • Efficient: Provides voltage that is easily converted for use through a medium that is small, low cost, and easily fabricated
  • Highly sensitive: Operates with ultra-high light sensitivity, even at very low light intensity, and fast response speeds
A Semiconductor Particle Detector Based on Work Function Modulation
  • Small: Can be used as a portable radiation detector
  • Versatile: Can be implemented in current particle detectors for accuracy testing and experimental verification
  • Scalable: Offers the potential to be used in creating an array of devices for implementation in larger research experiments
Efficient, Reliable, Robust Power Amplifiers for Wireless Communications
  • Increased efficiency — Satisfies zero voltage switching condition at 50% duty cycle and shapes the drain voltage at other duty cycles to minimize power loss
  • Improved reliability — Reduces peak drain swing
  • Mitigated variation — Determines optimal adaptation settings for each process shifted device using on-chip sensors and digital logic
New Methods of Fabrication for Biosensor Arrays
  • Low manufacturing and operating cost
  • Compatible with multiple standard electrochemical techniques
  • Can be used with CMOS detection chips with multiple chemical detection and/or actuation channels or sites
Carbon Nanotube Cold Cathodes
  • More efficient electric propulsion
  • Reduced power and mass expenditures
  • Does not require gas flow to emit electrons
Heterogeneous Interconnect Geometries in Electronic Packages
  • Increased electrical performance of the interconnects
  • Does not compromise mechanical reliability
  • Cost effective