Electronic Devices | Office of Technology Licensing

Available Technologies by Category
Self-Aligned HARPSS Micromechanical Variable Capacitors	Results in larger-value capacitors Requires only three lithography masks	4359
Multi-Band Operating BAW Resonator	Extremely high resonator Q Simple fabrication process Robust design — not fragile	4927
MINTED: Simultaneous Deformation and Temperature Imaging	Simultaneous recording of small-scale temperature and deformation fields at high spatial and time resolutions Studies deformation, failure, and heating in a range of materials Analyzes/monitors heating and failure of MEMS devices, microchips, and circuit board	8064
Electron Beam Induced Deposition of Nanostructures	Unique nano-fabrication process that allows direct-write of complex 3D nano-structures (e.g. cavities and overhangs) Fabrication process compatible with variety of materials on any substrates (planar and non-planar) Provides growth rate of amorphous carbon nano-structures 3 times greater than that of standard gas-phase FEBID	6998
Flexible Electrical Interconnects with Concave/Convex Platform	Co-fabrication of very complex interconnect structures for developing and testing different system topologies Improved system performance while increasing packaging density with little or no impact on the fabrication process steps used Complex shapes easily fabricated without compromising the mechanical strength or the electrical performance	6957
Large-Scale Manufacturing and Directed Assembly for Nanowires	Greater than 106 improvement in the rate of nanowire synthesis compared with the current state-of-the-art Applicable to diverse classes of materials, dopant concentrations, and morphologies Superstructure assembly is programmable via tip geometry and is material independent	6891
Fabrication of Slanted Electrodes in MEMS Devices	High Performance – slanted electrodes provide more capabilities and possibilities for MEMS devices Consolidated – reduces the need for large systems of MEMS Versatile – MEMS with slanted electrodes can be applied to many applications	7324
Smart Petri Chip: Electronic-Photonic Cellular Sensing Platform	Large-scale throughput, real-time cellular monitoring, and re- usability with no contamination Easily and inexpensively replaced Modules can be designed for various functions	6864
Infrared-Emitting Quantum Dots	Robust – more stable than current quantum dots Tunable – optical properties are tunable based on size, structure, and composition of the quantum dots Efficient IR-emission – allows for enhanced display definition and multi-band IR scene projection	7893
Methods of Recycling and Replacing Lithium Ion Batteries	Low cost – low energy use compared to other methods Environmentally friendly – low emissions High purity – accurate separation of high value metals from other components	7892, 7941
High-Precision Microphone for Body-Worn Devices	Wearable small form-factor (micro-chip technology) Increased sensitivity (micro-gravity sensitivity) Large bandwidth (DC to 10kHz) and wide dynamic range (120dB)	7891
Polymer-Polymer Fiber Composite for High Thermal Conductivity	Better mechanical properties – Process creates polymeric resin that is stronger and tougher than current methods Easier to process – Polymers are easier to make and process than metal materials Tunable electrical capabilities – Can be made as conducting or insulating	7848
Short Distance Gait Pace Meter	Accessible – Large-one-touch buttons, large results font, audible and visible sensor cues Inexpensive – Device components low-cost, installation standard wall-mount Convenient – As simple as recording weight or height: Press a button, walk, record speed.	7783
Facile Synthesis of Ultrathin Silver Nanowires	Produces Ag nanowires less than 20 nm in diameter, with high aspect ratios (over 1000), and in high yield (>85%) One pot, quick (< 35 min) synthetic process that is performed under ambient pressure Great mechanical flexibility and can be bent at acute angles without breaking	6791
Antenna-Less RFID Tag	Cheaper – minimized transmission components significantly reduces manufacturing costs Flexible – tags can be reprogrammed to perform different functions Smaller - reduced number of components allows for smaller chips	7744
Lithography-Free Nanowire Transistors	Scalable – Eliminating the cost and time associated with top-down patterning enables large-scale manufacturing High Performance – Achieves switching speeds well beyond 1 GHz at supply voltages near 0.5 V Adaptable – Device dimensions can be readily scaled as transistor fabrication techniques advance	7737
Method of Increasing III-Nitride Semiconductor Growth Rate	Faster growth rates result in reduced epitaxy cost Ability to grow at lower temperatures reduces thermal budget, stress and wafer bowing Ability to grow pseudo-substrates of any III-nitride alloy composition	7009
Reversible Doping of Semiconductor Films for Electronics	Effective – Reduction in film’s electrical resistance Scalable – Can control doping of large or small-scale bulk materials Simplified – Allows for stacking of organic semiconductor layers without cross-linking the layers	7017
Chemical Etching of Semiconductive Substrate	Quick – wafers can be processed in parallel, as compared to only one at a time with the current approach Low cost – tooling for this approach is much less expensive than that required for the currently used method; simple, inexpensive chemical	6696
Advanced Techniques in Floating-Gate Transistor Programming	Precise Smaller switch count Fewer parasitic	3458

Technologies