Semiconductors | Office of Technology Licensing

Available Technologies by Category
Carbon Nanotube Cold Cathodes	More efficient electric propulsion Reduced power and mass expenditures Does not require gas flow to emit electrons	4127
Heterogeneous Interconnect Geometries in Electronic Packages	Increased electrical performance of the interconnects Does not compromise mechanical reliability Cost effective	4120
Quantum Dot Lasing in Liquid Solution	Can report CdS in a room temperature liquid solution Allows for absorption and photoluminescence decay of the samples	3904
Patterned Graphene Structures on Silicon Carbide	Less damage: Growth of nanoribbons in desired shapes eliminates damage from post-processing to achieve desired dimensions. Scalable: 10,000 top-gated graphene transistors on a .24 SiC chip have been demonstrated. Room temperature operation: Prototypes exhibit an on-off ratio of 10 and carrier mobilities up to 2,700 cm2/ (V•s) at room temperature.	5589
Ultra-Thin Interposer Assemblies for Higher Integrated Circuit Bandwidth	Scalable, with connections above, below, and beside the interposer Lower cost, less complex manufacturing through interposer-package integration Testable, both before and after device integration	5453
Method for Packaging Advanced Sensors and Electronics	High volume — device can be used for simultaneous sensing of thousands of proteins or nucleic acid sequences Cheaper — utilizes low cost wafer-scale semiconductor manufacturing technologies Versatile — can be used for many chemical and biochemical sensors	4514
Method to modify the Conductivity of Graphene	Does not require the application of a dielectric layer to the graphene Graphene does not need to be chemically modified Maintains quality of graphene	5042
Hybrid Nanowire for Creating Mechanical Energy	Increased solar conversion efficiency Fibers increase the surface area of light exposure	4760
Flexible Electrical Interconnects with Concave/Convex Platform	Co-fabrication of very complex interconnect structures for developing and testing different system topologies Improved system performance while increasing packaging density with little or no impact on the fabrication process steps used Complex shapes easily fabricated without compromising the mechanical strength or the electrical performance	6957
Infrared-Emitting Quantum Dots	Robust – more stable than current quantum dots Tunable – optical properties are tunable based on size, structure, and composition of the quantum dots Efficient IR-emission – allows for enhanced display definition and multi-band IR scene projection	7893
Lithography-Free Nanowire Transistors	Scalable – Eliminating the cost and time associated with top-down patterning enables large-scale manufacturing High Performance – Achieves switching speeds well beyond 1 GHz at supply voltages near 0.5 V Adaptable – Device dimensions can be readily scaled as transistor fabrication techniques advance	7737
Chemical Etching of Semiconductive Substrate	Quick – wafers can be processed in parallel, as compared to only one at a time with the current approach Low cost – tooling for this approach is much less expensive than that required for the currently used method; simple, inexpensive chemical	6696
Edge Viewing Photodetector	Efficient Cheaper	3321
High-Resolution Pressure Sensors with Skin-Like Sensitivity	Extremely sensitive: This sensor array provides 1,000x higher sensitivity than other technologies. Improved performance: The technology is fast-responding and stable.	5895
Graphene Transistors: Nanoscale Electronic Components	Faster: Near-ballistic charge transport properties Cooler: Virtually no heat generation at high speeds Stronger: 100 times stronger than steel	5766
Low Work Function Electrodes for Flexible Electronics	More stable low-WF materials — Replaces reactive metals with easy-to-use, stable materials with comparable performance Less complex — Eliminates the need for a glass barrier or encapsulation layers to protect the material Less expensive — Lowers the cost of production through faster, easier manufacturing	5645
Perylene Compounds for Use in Electronics	High electron mobilties	3204
Metal Compounds for Use in Electronics	Potential for strong intermolecular overlap Low reorganization energies Tunability of redox potential	3202
Methods for Sensing Wearouts of Electronic Circuits	Circuit details are taken into account in estimating lifetime Wearout methods can be used to determine “timing closure” at 10 years lifetime Methods serve as foundation for a new electronic design automation tool for “timing closure”	7145
Ultra-Compact, Low-Power THz Radio	A THz fully integrated super-harmonic (2nd harmonic) regenerative receiver architecture, which detects the incoming THz signals and injection-locks to a regenerative receiver operating at a lower frequency Reduces power consumption and improves the efficiency for THz signal generations Employs a bidirectional and circuit-sharing architecture, so the THz receiver and the THz transmitter share the same oscillator operating at half the frequency	7053

Technologies