Circuits | Office of Technology Licensing

Available Technologies by Category
Improved Projection Exposure System for Fabricating Nanomaterials	High speed processing: Enables rapid prototyping and large-scale manufacturing Simple optics: Nano-scale patterning achieved without complex optical systems or photomasks Cost effective: Replaces slow and expensive electron beam lithography	5283
REMS Sensors for Environmental Monitoring	Low cost – decreases expenses by being compatible with existing UHF or microwave passive RFID integrated circuits Precise – because an RFID readers filters out unmodulated scatter components, an RFID-based REMS sensor is more precise Allows passive interrogation of the sensor	4561
Container Security Device	Versatile: can be used on various types of containers Facilitated communication: the door sensors are able to communicate with a controller Efficient: does not require reduction or intrusion of cargo space	4461
Advance Mobility Improvement for Organic Field Effect Transistors	Dramatic increase in mobility: Yields a 2-order-of-magnitude increase in charge transport Fast: Achieves 100-fold improvements after a mere 5 minutes of ultrasound Simple: Requires only low-intensity ultrasound and eliminates the need for dielectric surface modifications or post-deposition treatment of the device	5187
Power Generation via Traveling Domains	Improved methods and circuits for generating millimeter-wave oscillations High-speed microwave data links	5144
Minimizing Power Failure from Weather Disruptions	Efficient – Allows power grid resilience for a community to be determined in the best possible manner by the electric utility while minimizing the impact of weather-related events Analytical – Capable of analyzing and determining spots most or least resilient as well as time durations between failure and recovery Customizable – Ability to tailor the model’s overall framework to include global and local parameters in the analysis and determination of performance issues	6665
High-Speed Autofocus Interometric Inspection System	High-speed Fully noncontact Nondestructive inspection techniques for investigating solder bump and joint integrity	4750
MINTED: Simultaneous Deformation and Temperature Imaging	Simultaneous recording of small-scale temperature and deformation fields at high spatial and time resolutions Studies deformation, failure, and heating in a range of materials Analyzes/monitors heating and failure of MEMS devices, microchips, and circuit board	8064
Methods for Sensing Wearouts of Electronic Circuits	Circuit details are taken into account in estimating lifetime Wearout methods can be used to determine “timing closure” at 10 years lifetime Methods serve as foundation for a new electronic design automation tool for “timing closure”	7145

Technologies