Available Technologies by Category
Flexible Electrical Interconnects with Concave/Convex Platform
  • Co-fabrication of very complex interconnect structures for developing and testing different system topologies 
  • Improved system performance while increasing packaging density with little or no impact on the fabrication process steps used
  • Complex shapes easily fabricated without compromising the mechanical strength or the electrical performance
6957
Fabrication of Slanted Electrodes in MEMS Devices
  • High Performance – slanted electrodes provide more capabilities and possibilities for MEMS devices
  • Consolidated – reduces the need for large systems of MEMS
  • Versatile – MEMS with slanted electrodes can be applied to many applications
7324
Method of Increasing III-Nitride Semiconductor Growth Rate
  • Faster growth rates result in reduced epitaxy cost
  • Ability to grow at lower temperatures reduces thermal budget, stress and wafer bowing
  • Ability to grow pseudo-substrates of any III-nitride alloy composition
7009
Chemical Etching of Semiconductive Substrate
  • Quick – wafers can be processed in parallel, as compared to only one at a time with the current approach
  • Low cost – tooling for this approach is much less expensive than that required for the currently used method; simple, inexpensive chemical
6696
High-Frequency AIN-on-Silicon Resonant Square Gyroscopes
  • Low-cost –  Straightforward manufacturing process reduces cost and complexity
  • Higher frequency operation – Realizes higher frequency of operation for resonant gyroscopes and provides higher rotation rate sensitivity
6375
Graphene Transistors: Nanoscale Electronic Components
  • Faster: Near-ballistic charge transport properties
  • Cooler: Virtually no heat generation at high speeds
  • Stronger: 100 times stronger than steel
5766
Stiffness Trimming of High Q MEMS Clocks and Oscillators
  • High resolution stiffness trimming of high-Q Lame mode silicon resonators
  • Stable frequency characteristics of Ge-coated Si resonators at high processing temperatures
  • Achieves trimming without introducing any damping throughout process
7184
Non-contact vital sign detection
  • Automatically adjusts the feedback signals to suppress the noise when the measurement environment changes
  • Improves SNR by 50% at 50 cm when compared to an unlocked system
  • Detects heartbeat at 250 cm, more than twice the distance of the unlocked system
7064