Technologies by Rao Tummaia
Ultra-Thin Interposer Assemblies for Higher Integrated Circuit Bandwidth
An ultra-small pitch structure that uses ultra-thin (20- to 200-mm) interposers containing ultra-high density through-via interconnections to achieve bandwidth rates of at least ~10 gigabytes/second (GB/s)
An ultra-small pitch structure that uses ultra-thin (20- to 200-mm) interposers containing ultra-high density through-via interconnections to achieve bandwidth rates of at least ~10 gigabytes/second (GB/s)
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