Techs by Karan Kacker


Cost-Effective Compliant Off-Chip Interconnects Packaging techniques utilizing compliant interconnects with multiple electrical paths in an electronic package	3964
Electrical Path Interconnects for use in Electronic Packages A compliant interconnect technology called “FlexConnects”	4198
Heterogeneous Interconnect Geometries in Electronic Packages A variable interconnect geometry with increased electrical performance	4120
Interconnect Geometry for Electronic Packages A variable interconnect geometry formed on a substrate	3883

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