Semiconductors | Office of Technology Licensing

Available Technologies by Category
BiCMOS Process Integrated Silicon-Germanium Avalanche Photodiode	The invention introduces a novel semiconductor photodetector design, leveraging the principle of avalanche multiplication to detect light signals effectively. It enables cost-effective high-volume production through the utilization of existing semiconductor foundry processes, bypassing traditional constraints. This innovative design supports the integration of a complete optical receiver subsystem onto a single chip, thereby enhancing performance and streamlining production processes.	8741
Controlling the Solubility and Electrical Conductivity of Organic Semiconductor Films by Reversible Doping	This innovation introduces a novel approach for achieving precise p-type doping and reversible solubility control in organic semiconductor layers, thereby enhancing their conductivity and stability. It provides solution processability and minimal dopant diffusion, leading to improved performance and versatility for a wide range of electronic devices. This technology finds applications in printed electronics, organic solar cells, LEDs, transistors, and sensors, facilitating the production of thin, flexible components with enduring performance.	7017
Leverage the Advantages of Aluminum Nitride for Superior Ultra-Wide Bandgap Semiconductors for High-Power, High-Temperature Diodes and Transistors	Metal modulated epitaxy method enables the production of p-type beryllium-doped aluminum nitride films as key components in ultra-wide bandgap semiconductors for the first time. Achieves high reverse breakdown voltage—a significant advantage over wide bandgap materials such as silicon carbide and gallium nitride. Improves current conduction over best previous results in p-type aluminum nitride (AIN) by 30,000,000 times and n-type AlN by 6,000 times.	8666
Overvoltage Surge Protection System for Distributed Energy Resources	iMOV is a dynamic system capable of achieving voltage surge clamping within 20% of the system’s nominal voltage. This effectively provides protection for highly sensitive semiconductors present in DER-associated power converters. This system is built upon a metal oxide varistors (MOV) foundation, whose material composition inherently allows rapid device connection of 500 picoseconds for quicker response times. iMOV uses integrated microprocessors and sensors in a cloud-based architecture that provides protection against cyberattacks, reduces system cost, and allows system and power grid monitoring.	9190
Microgeodes Enable Tunable Optical Response for Advanced Coatings/Paint	Microgeodes have a programmable structure of nanowires that allows their optical response to be engineered precisely over multiple spectral bands, from UV through mid-IR. Microgeodes combine the tunability and versatility of nanowires with the processability of microspheres to provide a photonic materials platform for a wide range of applications. Microgeode paints could reduce building surface temperatures by as much as 25°C, offering the potential for significant consumer savings while retaining aesthetically pleasing colors.	8866
Solar Cell Manufacturing Technique Increases Efficiency and Lowers Costs	This double-side polysilicon/silicon oxide TOPCon (tunnel oxide passivated contact) solar cell concept provides a simple and low-cost way to passivate front and back surfaces of silicon wafers to enhance efficiency. Provides current and voltage comparable to full-area double-side TOPCon but with no appreciable absorption in front polysilicon and without compromising short circuit current density Includes a novel and fast way to pattern polysilicon using laser-induced selective oxidation	8888
Superluminescent Light Projection (SLP) System Decreases Nanoscale Printing Costs by 10–50 Times	This superluminescent light projection (SLP) system decreases overall nanoscale printing costs by 10–50 times. A parallel writing mechanism supports higher throughput speeds: up to 100 times higher than existing metal printing methods and four times higher than existing polymer printing methods. SLP creates sharp-edged images with minimal speckling patterns, resulting in high-resolution images and structures on both polymer and metal-based films.	9066
Metasurface Enables Rapid, Sensitive, and Low-Cost Permittivity Characterization of Dielectric Materials at Radio Frequencies	Characterize complex permittivity of dielectric materials at radio frequencies quickly and at lower cost than with existing techniques. The electronically reconfigurable system allows integration of active electronics for tunability and eliminates the need for several masks to achieve the needed bandwidth. Measure individual frequencies by swapping out only the metasurfaces, which can be used on a wide range of sample thicknesses.	9078
Novel Silicon Radiation Detector Enabled By Tunnel Oxide Passivating Contact	The technology passivates the bottom surface well and suppresses electron recombination near the bottom contact, resulting in low leakage current. Passivating the silicon surface and decreasing hole recombination near the front contact leads to low recombination current density at the surface and low effective contact resistivity. An extremely low J0 for the tunnel oxide passivating contact on both sides yields a higher energy resolution and lower noise level.	9227
Lightweight, Versatile Cryogenic Conductors	Lithium exhibits lower atomic mass, higher power density, and lower losses under cryogenic conditions Conductors such as lithium become even more power-dense at lower temperatures, exhibiting improved electrical performance Cladding with copper enables lithium to be drawn using standard wire-drawing techniques and tools	8729
Raised Cosine (RC) Pulse Shaping for Next Generation Multi-Mode Fiber (MMF) Links	Small design: Uses direct modulation and detection with VCSEL-based MMF links for small form factor High speeds with low cost and power: Achieves speeds of 100 Gbps and higher while maintaining low cost and low power consumption with VCSEL MMF-based links and other direct-modulated lasers Low bandwidth requirements: Minimizes intersymbol interference and reduces the required electrical bandwidth to enable use with commercially packaged VCSELs that have bandwidth in the low 20 GHz range	7398
A Method for Creating a Protective Cap Layer for Semiconductor Wafers	Protective: Provides a thin protective layer or “cap” after the first layer is deposited, protecting the underlying structure from atmospheric contaminants Robust: Enables realization of the advantages of hybrid growth processes by eliminating performance-degrading contaminants and resulting defects Advanced: Offers superior protection against contamination compared with simple chemical cleaning methods utilized in other systems, especially against impurity species such as oxides	8435
Chip-Scale Electrochemical Double-Layer (ECDL) Supercapacitors	Decreased size: Minimizes space that does not contribute to volumetric density and is drastically smaller than conventional ECDL capacitors, allowing capacitor-dependent devices to shrink considerably High power: Achieves gravimetric energy densities of over 100 watt-hours per kilogram Improved performance: The vertically aligned graphene-functionalized carbon nanotubes Offers high porosity and surface area for improved pseudocapacitance by vertically aligning graphene-functionalized nanotubes	6573
Spin-Coated Polymer Collars Prevent Solder Wicking	Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.	8747
Fabricating High-Power Solar Cells with a Novel Boron Emitter	Efficient: Demonstrates a competitive level of efficiency road map of over 24.2% Cost-effective: Offers a simplified approach for fabricating TOPCon solar cells while still maintaining their efficiency Sustainable: Improves upon current renewable energy solutions that provide alternatives to fossil fuel–based energy consumption	7991
Heterogeneous Integration Method for III-Nitride Devices	High performance: Enables simple and fast transfer to foreign substrates with an automated pick-and-place technique Compatible: Can be used to transfer devices of any shape and size—from micron to millimeter Efficient: Allows reuse of the growth wafer, lowering production costs	7910
High-Performance Broadband Photodetector and Power Generator	Versatile: Adjusts for several different parameters, including light intensity, switching frequency, and illumination area Efficient: Provides voltage that is easily converted for use through a medium that is small, low cost, and easily fabricated Highly sensitive: Operates with ultra-high light sensitivity, even at very low light intensity, and fast response speeds	7965
A Semiconductor Particle Detector Based on Work Function Modulation	Small: Can be used as a portable radiation detector Versatile: Can be implemented in current particle detectors for accuracy testing and experimental verification Scalable: Offers the potential to be used in creating an array of devices for implementation in larger research experiments	8410
Efficient, Reliable, Robust Power Amplifiers for Wireless Communications	Increased efficiency — Satisfies zero voltage switching condition at 50% duty cycle and shapes the drain voltage at other duty cycles to minimize power loss Improved reliability — Reduces peak drain swing Mitigated variation — Determines optimal adaptation settings for each process shifted device using on-chip sensors and digital logic	6210
New Methods of Fabrication for Biosensor Arrays	Low manufacturing and operating cost Compatible with multiple standard electrochemical techniques Can be used with CMOS detection chips with multiple chemical detection and/or actuation channels or sites	4231

Technologies