Georgia Tech researchers have developed a method to significantly decrease the dielectric constant and loss of epoxies by incorporating closed-pores within the epoxy material. The pores are created by modifying the epoxy monomer with a pore-creating component. Upon molding and heat treatment of the epoxy, the porogen reacts and decomposes to create small, closed-pores within the epoxy film. This reduces the risk of cracks and continuous air-pathways throughout the film, which may result in deteriorated mechanical properties. This new epoxy matrix with closed-pores reduces the dielectric constant and loss of the bulk material.
- Cost Effective – Modified epoxy is lower cost than advanced, high performance polymers
- Effective – Lowers dielectric constant and loss of the material
- Non-destructive – Does not deteriorate the mechanical properties of the material
- Printed wiring boards
- Integrated circuits
Polymers are insulating materials used for fabricating printed circuit boards and electrical devices, such as a computer or cell phone. Epoxies have many desirable properties, however, they suffer from high capacitance and loss, which can slow down electronic devices, and cause cross-talk. Epoxy polymers are low-cost and have excellent chemical resistance and adhesive properties. The electrical performance can be improved by decreasing the dielectric constant and loss of epoxy materials.