Semiconductors | Technology Licensing

Available Technologies by Category

Microgeodes Enable Tunable Optical Response for Advanced Coatings/Paint Microgeodes have a programmable structure of nanowires that allows their optical response to be engineered precisely over multiple spectral bands, from UV through mid-IR. Microgeodes combine the tunability and versatility of nanowires with the processability of microspheres to provide a photonic materials platform for a wide range of applications. Microgeode paints could reduce building surface temperatures by as much as 25°C, offering the potential for significant consumer savings while retaining aesthetically pleasing colors.	8866
Lightweight, Versatile Cryogenic Conductors Lithium exhibits lower atomic mass, higher power density, and lower losses under cryogenic conditions Conductors such as lithium become even more power-dense at lower temperatures, exhibiting improved electrical performance Cladding with copper enables lithium to be drawn using standard wire-drawing techniques and tools	8729
Raised Cosine (RC) Pulse Shaping for Next Generation Multi-Mode Fiber (MMF) Links Small design: Uses direct modulation and detection with VCSEL-based MMF links for small form factor High speeds with low cost and power: Achieves speeds of 100 Gbps and higher while maintaining low cost and low power consumption with VCSEL MMF-based links and other direct-modulated lasers Low bandwidth requirements: Minimizes intersymbol interference and reduces the required electrical bandwidth to enable use with commercially packaged VCSELs that have bandwidth in the low 20 GHz range	7398
Thin Current Spreading Layers Improve Breakdown Performance Increases current uniformity: Improves cumulative current flow distribution from ~40% to ~100% of the p-type contact Improves breakdown performance: Avoids premature breakdown at the mesa edges making quasi-vertical devices comparable in performance to more expensive vertical devices. Improves Immunity to Etch Variation: Because current flow is no longer crowded along the mesa edges, process related variations in the mesa etching are less important to the diode performance.	8789
Cascaded Nickel Hard Mask Substantially deeper etches: Because a very thick metal mask can be created, a wide range of µm features can be etched in a variety of III-Nitride semiconductors, allowing for extremely high voltage devices that require thicker layer structures Robust: This method has demonstrated highly consistent and effective protection against the kind of damage that is typical with standard fabrication methods Scalable: The nickel hard mask with cascaded e-beam evaporation and sputtering metal deposition method can readily be applied to the large-scale production of electronic devices	8790
p-type Be-Doped AlN Films and Layered Films Enabling: Leverages MME method to provide the first access to p-type AlN:Be films, a superior ultra-wide bandgap semiconductor material good for high-power, high-temperature diodes and transistors Ease of fabrication: Avoids costly and complicated methods unfavorable for beryllium doping Improved breakdown performance: Achieves high reverse breakdown voltage—a significant advantage over WBG materials such as silicon carbide (SiC) and GaN	8810, 8666, 8786
A Method for Creating a Protective Cap Layer for Semiconductor Wafers Protective: Provides a thin protective layer or “cap” after the first layer is deposited, protecting the underlying structure from atmospheric contaminants Robust: Enables realization of the advantages of hybrid growth processes by eliminating performance-degrading contaminants and resulting defects Advanced: Offers superior protection against contamination compared with simple chemical cleaning methods utilized in other systems, especially against impurity species such as oxides	8435
Chip-Scale Electrochemical Double-Layer (ECDL) Supercapacitors Decreased size: Minimizes space that does not contribute to volumetric density and is drastically smaller than conventional ECDL capacitors, allowing capacitor-dependent devices to shrink considerably High power: Achieves gravimetric energy densities of over 100 watt-hours per kilogram Improved performance: The vertically aligned graphene-functionalized carbon nanotubes Offers high porosity and surface area for improved pseudocapacitance by vertically aligning graphene-functionalized nanotubes	6573
Spin-Coated Polymer Collars Prevent Solder Wicking Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.	8747
Advanced High-Sensitivity Device for Gas Detection Rapid response: Provides results for gas detection through the nanostructure island sites within 2 seconds on average Heat resistant: Works effectively in temperatures ranging from room temperature to 200 °C Easily modified: Provides a range of sensitivities for a broad range of gases for use in many commercial industries	3939
Fine-Pitch Chip-to-Substrate Interconnect Assemblies for Advanced Electronics Applications Secure: Forms a mechanical locking structure via the bump and substrate deformation Strong: Relies on compressive stresses developed during the adhesive curing process to create the connection between chip bumps and substrate pads Economical: Costs significantly less than interconnect assemblies made with gold bumps	4878
High-Performance Broadband Photodetector Enhanced sensitivity: Functions over a wide range of wavelengths—from near-ultraviolet to near-infrared High performance: Operates at high-speed response conditions in wide spectral bandwidth for various applications High stability and repeatability: Offers significant photo-sensing ability with no deviation or degradation observed after one year	7963
Fabricating High-Power Solar Cells with a Novel Boron Emitter Efficient: Demonstrates a competitive level of efficiency road map of over 24.2% Cost-effective: Offers a simplified approach for fabricating TOPCon solar cells while still maintaining their efficiency Sustainable: Improves upon current renewable energy solutions that provide alternatives to fossil fuel–based energy consumption	7991
Heterogeneous Integration Method for III-Nitride Devices High performance: Enables simple and fast transfer to foreign substrates with an automated pick-and-place technique Compatible: Can be used to transfer devices of any shape and size—from micron to millimeter Efficient: Allows reuse of the growth wafer, lowering production costs	7910
High-Performance Broadband Photodetector and Power Generator Versatile: Adjusts for several different parameters, including light intensity, switching frequency, and illumination area Efficient: Provides voltage that is easily converted for use through a medium that is small, low cost, and easily fabricated Highly sensitive: Operates with ultra-high light sensitivity, even at very low light intensity, and fast response speeds	7965
A Semiconductor Particle Detector Based on Work Function Modulation Small: Can be used as a portable radiation detector Versatile: Can be implemented in current particle detectors for accuracy testing and experimental verification Scalable: Offers the potential to be used in creating an array of devices for implementation in larger research experiments	8410
Efficient, Reliable, Robust Power Amplifiers for Wireless Communications Increased efficiency — Satisfies zero voltage switching condition at 50% duty cycle and shapes the drain voltage at other duty cycles to minimize power loss Improved reliability — Reduces peak drain swing Mitigated variation — Determines optimal adaptation settings for each process shifted device using on-chip sensors and digital logic	6210
Evaporation Enhanced Heat Sink and Condensation Unit High degree of integration - system compactness for miniaturization Heat reduction - removal of very high temperature fluxes, or moderate heat fluxes over large domains Low power operation	4282, 4362
New Methods of Fabrication for Biosensor Arrays Low manufacturing and operating cost Compatible with multiple standard electrochemical techniques Can be used with CMOS detection chips with multiple chemical detection and/or actuation channels or sites	4231
Carbon Nanotube Cold Cathodes More efficient electric propulsion Reduced power and mass expenditures Does not require gas flow to emit electrons	4127
Heterogeneous Interconnect Geometries in Electronic Packages Increased electrical performance of the interconnects Does not compromise mechanical reliability Cost effective	4120
Quantum Dot Lasing in Liquid Solution Can report CdS in a room temperature liquid solution Allows for absorption and photoluminescence decay of the samples	3904
Programmable Voltage Reference for Voltage Accuracy Stable Programmable Compact	3837
Patterned Graphene Structures on Silicon Carbide Less damage: Growth of nanoribbons in desired shapes eliminates damage from post-processing to achieve desired dimensions. Scalable: 10,000 top-gated graphene transistors on a .24 SiC chip have been demonstrated. Room temperature operation: Prototypes exhibit an on-off ratio of 10 and carrier mobilities up to 2,700 cm2/ (V•s) at room temperature.	5589
Ultra-Thin Interposer Assemblies for Higher Integrated Circuit Bandwidth Scalable, with connections above, below, and beside the interposer Lower cost, less complex manufacturing through interposer-package integration Testable, both before and after device integration	5453
Method for Packaging Advanced Sensors and Electronics High volume — device can be used for simultaneous sensing of thousands of proteins or nucleic acid sequences Cheaper — utilizes low cost wafer-scale semiconductor manufacturing technologies Versatile — can be used for many chemical and biochemical sensors	4514
Method to modify the Conductivity of Graphene Does not require the application of a dielectric layer to the graphene Graphene does not need to be chemically modified Maintains quality of graphene	5042
Superjunction Collector Bipolar Transistors Higher breakdown voltages — higher breakdown voltages with no performance degradation Improved design- involving super junction collector features Scalable- operable at room temperature and voltage ranges from 1V to 20V	4797
Hybrid Nanowire for Creating Mechanical Energy Increased solar conversion efficiency Fibers increase the surface area of light exposure	4760
Flexible Electrical Interconnects with Concave/Convex Platform Co-fabrication of very complex interconnect structures for developing and testing different system topologies Improved system performance while increasing packaging density with little or no impact on the fabrication process steps used Complex shapes easily fabricated without compromising the mechanical strength or the electrical performance	6957
Infrared-Emitting Quantum Dots Robust – more stable than current quantum dots Tunable – optical properties are tunable based on size, structure, and composition of the quantum dots Efficient IR-emission – allows for enhanced display definition and multi-band IR scene projection	7893
Lithography-Free Nanowire Transistors Scalable – Eliminating the cost and time associated with top-down patterning enables large-scale manufacturing High Performance – Achieves switching speeds well beyond 1 GHz at supply voltages near 0.5 V Adaptable – Device dimensions can be readily scaled as transistor fabrication techniques advance	7737
Reversible Doping of Semiconductor Films for Electronics Effective – Reduction in film’s electrical resistance Scalable – Can control doping of large or small-scale bulk materials Simplified – Allows for stacking of organic semiconductor layers without cross-linking the layers	7017
Chemical Etching of Semiconductive Substrate Quick – wafers can be processed in parallel, as compared to only one at a time with the current approach Low cost – tooling for this approach is much less expensive than that required for the currently used method; simple, inexpensive chemical	6696
Edge Viewing Photodetector Efficient Cheaper	3321
Chemically-Amplified Permanent Insulator Improved – Superior electrical isolation, smaller size and cross-linking capability Cost-saving – Lower power and increased processing and manufacturing speeds	6076
High-Resolution Pressure Sensors with Skin-Like Sensitivity Extremely sensitive: This sensor array provides 1,000x higher sensitivity than other technologies. Improved performance: The technology is fast-responding and stable.	5895
Graphene Transistors: Nanoscale Electronic Components Faster: Near-ballistic charge transport properties Cooler: Virtually no heat generation at high speeds Stronger: 100 times stronger than steel	5766
Low Function Electrodes for Flexible Electronics More stable low-WF materials — Replaces reactive metals with easy-to-use, stable materials with comparable performance Less complex — Eliminates the need for a glass barrier or encapsulation layers to protect the material Less expensive — Lowers the cost of production through faster, easier manufacturing	5645
Perylene Compounds for Use in Electronics High electron mobilties	3204

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