Components | Technology Licensing

Available Technologies by Category

Lightweight, Versatile Cryogenic Conductors Lithium exhibits lower atomic mass, higher power density, and lower losses under cryogenic conditions Conductors such as lithium become even more power-dense at lower temperatures, exhibiting improved electrical performance Cladding with copper enables lithium to be drawn using standard wire-drawing techniques and tools	8729
DetectIV Offers Noninvasive Early IV Infiltration and Extravasation Detection DetectIV provides a continuous, noninvasive, and wireless IV infiltration and extravasation detection system. The sensor does not cover the IV site and works well with all skin types—significant improvements over existing detection devices. The device detects infiltrations on average 2 hours ahead of nursing standard of care making it an effective early detection system that prevents extended hospital stays.	7207
Variable Slope, Multi-Octave Radio Frequency Filters Customizable: The combined signal may be applied to a standard low-pass, band pass, or high-pass optical filter. The filter can be implemented with any number of poles for a maximum defined-slope, and the choice of pass type may be made according to the desired slope direction. Variable: By moving the optical carrier up and down in frequency through the transition band, the slope of the RF signal can be continuously varied. Versatile: The technology can be used as is or it can augment existing RF lab equipment.	7680
Thin Current Spreading Layers Improve Breakdown Performance Increases current uniformity: Improves cumulative current flow distribution from ~40% to ~100% of the p-type contact Improves breakdown performance: Avoids premature breakdown at the mesa edges making quasi-vertical devices comparable in performance to more expensive vertical devices. Improves Immunity to Etch Variation: Because current flow is no longer crowded along the mesa edges, process related variations in the mesa etching are less important to the diode performance.	8789
Cascaded Nickel Hard Mask Substantially deeper etches: Because a very thick metal mask can be created, a wide range of µm features can be etched in a variety of III-Nitride semiconductors, allowing for extremely high voltage devices that require thicker layer structures Robust: This method has demonstrated highly consistent and effective protection against the kind of damage that is typical with standard fabrication methods Scalable: The nickel hard mask with cascaded e-beam evaporation and sputtering metal deposition method can readily be applied to the large-scale production of electronic devices	8790
p-type Be-Doped AlN Films and Layered Films Enabling: Leverages MME method to provide the first access to p-type AlN:Be films, a superior ultra-wide bandgap semiconductor material good for high-power, high-temperature diodes and transistors Ease of fabrication: Avoids costly and complicated methods unfavorable for beryllium doping Improved breakdown performance: Achieves high reverse breakdown voltage—a significant advantage over WBG materials such as silicon carbide (SiC) and GaN	8810, 8666, 8786
Chip-Scale Electrochemical Double-Layer (ECDL) Supercapacitors Decreased size: Minimizes space that does not contribute to volumetric density and is drastically smaller than conventional ECDL capacitors, allowing capacitor-dependent devices to shrink considerably High power: Achieves gravimetric energy densities of over 100 watt-hours per kilogram Improved performance: The vertically aligned graphene-functionalized carbon nanotubes Offers high porosity and surface area for improved pseudocapacitance by vertically aligning graphene-functionalized nanotubes	6573
Spin-Coated Polymer Collars Prevent Solder Wicking Extend product lifespan: Increasing the stability of the contact between socket paddles and the Au surface allows for the BGAs to be in use longer Stability: Adding the mechanical reinforcement of the polymer collars allows for stronger thermodynamically stable solder joints Simple manufacturing: Spin coating the polymer onto the package is a simple manufacturing process.	8747
Superior Supercapacitors High performance: Achieves average energy densities as high as 90 Wh/Kg Scalable: Leverages a low-cost PAN fabrication process that dramatically increases surface area Widely applicable: Demonstrates potential for advances in a variety of energy storage and capacitive water desalination applications	6201
Fine-Pitch Chip-to-Substrate Interconnect Assemblies for Advanced Electronics Applications Secure: Forms a mechanical locking structure via the bump and substrate deformation Strong: Relies on compressive stresses developed during the adhesive curing process to create the connection between chip bumps and substrate pads Economical: Costs significantly less than interconnect assemblies made with gold bumps	4878
Flight Control System for Miniature Aerial Robots Lightweight: Features a core electronics board that weighs less than half a gram Flexible: Contains a core electronics board that can be conveniently reprogrammed for expanded functionality Compact: Offers a small form factor with an area of about 2 square centimeters	8591
Heat Dissipation for Microelectronic Systems via Capillary Trap Effective: Dissipates large heat fluxes via 3D heat spreading and evaporative cooling that could approach kW/cm2 and beyond while keeping the surface temperature under 90oC Preventive: Mitigates coolant dry-out at the critical heat flux levels that result in a rapid and large temperature rise and thus cause device burn-out Efficient: Exploits high cooling capabilities associated with phase-change heat transfer through evaporation	6272
A First-of-its-Kind, Ultra-Low Voltage Single-Element Amplified Backscatter System Streamlined: Uses a single element—one tunnel diode with few passive components—to achieve dual functionality of simultaneous oscillation and reflection-amplification Efficient: Combines the features of conventional RFIDs and tunnel diode-based reflection amplifiers while using an extremely low biasing voltage of only 88 mV, consuming only 20 μW, and offering a reflection gain of 48 dB Long range: Provides the highest observed gain in the literature for a given input power	8375
Highly Effective Motion Capture Marker for Small Aerial Robots Robust: Improves the reliability and accuracy of the motion capture measurement by eliminating excessive reflection Easy to use: Consists of only a miniature driver circuit and illumination stripe while requiring a simple plug-in power supply to operate Lightweight: Accommodates small robots with limited payload capacity—total weight of an active marker is approximately 1 gram	8528
Stackable Isolated Voltage Optimization Module Provides the ability to boost or buck the voltage of in one phase of a three phase circuit without affecting the corresponding phase angle Enables autonomous operation and control	7294
Nanogenerator for Harvesting Energy Compact – Easily used for small electronics Energy saving – Harnesses energy from human body and water wave motions	6668
Evaporation Enhanced Heat Sink and Condensation Unit High degree of integration - system compactness for miniaturization Heat reduction - removal of very high temperature fluxes, or moderate heat fluxes over large domains Low power operation	4282, 4362
Carbon Nanotube Cold Cathodes More efficient electric propulsion Reduced power and mass expenditures Does not require gas flow to emit electrons	4127
Interconnect Geometry for Electronic Packages Enhanced electrical performance without decrease mechanical reliability Effective power distribution design and thermal management Cost effective	3883
Piezo-On-Diamond Resonators and Resonator Systems Easy to use Customizable Compatible	3870
Indirect Programming of Floating-Gate Transistors Reduced switch count Fewer parasitics Better overall performance	3838
Programmable Voltage Reference for Voltage Accuracy Stable Programmable Compact	3837
Eliminating Phase Separation Issues Phase separation is eliminated Growth process is faster Processing temperatures are lower and over a wider range	5459
Ultra-Thin Interposer Assemblies for Higher Integrated Circuit Bandwidth Scalable, with connections above, below, and beside the interposer Lower cost, less complex manufacturing through interposer-package integration Testable, both before and after device integration	5453
Translating Sound into Soft Touch for Haptic Devices Low cost: Uses components that are less expensive than other high-tech options Better response: Responds more quickly and more refined/granular than existing products with slow and/or coarse responsiveness Enhanced performance: Achieves a silent, smoother, pulse-like response rather than an unpleasant push or buzz	5433
Periodic Arrays for Frequency-Based Beam Steering Avoids individual control of array components Reduced cost, smaller design equipment	4716
Power Optimized Waveform Range – greater wireless power range Efficiency – greater wireless power efficiency Reliability – increased wireless power reliability	4570
A Method for Preparing Electrically Conductive Carbon Nanotubes for Electronic Applications	4419
Proton Conducting Polymer Membranes High proton conductivity Thermal stability Strong mechanical properties	3688
Fuel Cell Membranes That Operate at High Temperature High conductivity at high temperature and low humidity Mechanically stable — PEMs do not tear or deform under normal operating conditions Reduced acid leaching — unique acid doping between layers reduces leaching, which prolongs the life of the fuel cell	4346
Advance Mobility Improvement for Organic Field Effect Transistors Dramatic increase in mobility: Yields a 2-order-of-magnitude increase in charge transport Fast: Achieves 100-fold improvements after a mere 5 minutes of ultrasound Simple: Requires only low-intensity ultrasound and eliminates the need for dielectric surface modifications or post-deposition treatment of the device	5187
Optical Fiber-Based Solar Cells Remote function Greater mobility Can be hidden and located off the surface where sunlight is unavailable	4520
Self-Aligned HARPSS Micromechanical Variable Capacitors Results in larger-value capacitors Requires only three lithography masks	4359
AFM Cantilevers for Operation in Air and Immersion Efficient — enables fast actuation with integrated electrostatic actuators Accuracy — accurate force measurements with nanoscale lateral resolution Improved speed — improvement for both speed of actuation and accuracy of detection	3629
Multi-Band Operating BAW Resonator Extremely high resonator Q Simple fabrication process Robust design — not fragile	4927
MINTED: Simultaneous Deformation and Temperature Imaging Simultaneous recording of small-scale temperature and deformation fields at high spatial and time resolutions Studies deformation, failure, and heating in a range of materials Analyzes/monitors heating and failure of MEMS devices, microchips, and circuit board	8064
Analog Distributed Arithmetic Less power required Use less memory Less chip area	3460
Flexible Electrical Interconnects with Concave/Convex Platform Co-fabrication of very complex interconnect structures for developing and testing different system topologies Improved system performance while increasing packaging density with little or no impact on the fabrication process steps used Complex shapes easily fabricated without compromising the mechanical strength or the electrical performance	6957
Large-Scale Manufacturing and Directed Assembly for Nanowires Greater than 106 improvement in the rate of nanowire synthesis compared with the current state-of-the-art Applicable to diverse classes of materials, dopant concentrations, and morphologies Superstructure assembly is programmable via tip geometry and is material independent	6891
Fabrication of Slanted Electrodes in MEMS Devices High Performance – slanted electrodes provide more capabilities and possibilities for MEMS devices Consolidated – reduces the need for large systems of MEMS Versatile – MEMS with slanted electrodes can be applied to many applications	7324

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