Available Technologies
High Temperature Technologies in Advanced Materials
Available Technologies by Category
Buoyant Platform Assembly Improves PCM Thermal Management
Simplifies and aids in solidification for phase change material applications
8835
Cascaded Nickel Hard Mask
Scalable, consistent method using plasma etching to create deep mesas for high-power devices
8790
p-type Be-Doped AlN Films and Layered Films
Leveraging the advantages of AIN for ultra-wide bandgap semiconductors as transistors
8810, 8666, 8786
Thin Current Spreading Layers Improve Breakdown Performance
For high-power III-nitride devices
8789
Spin-Coated Polymer Collars Prevent Solder Wicking
Extends lifetime of ball grid array (BGA) packages in electronics
8747
Unique Processing Method for Highly Durable Bismaleimide Plastic
An unprecedented level of impact strength without the use of chemical additives
7994
Ceramic Pump and Valve for Liquid Metals
A ceramic pump and valve that allows the use of liquid metals at extreme temperatures
7284